L. Choobineh

Performance Analysis and Shape Optimization of an Impingement Microchannel Cold Plate

B. Sammakia, P. Chiarot, C. H. Hoang, 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

R. Geer, L. Choobineh, R. Carrol, 2020 .

Thermally assisted spatially directed pore formation in poly-dimethylsiloxane (PDMS)

A. Jain, V. Vishwakarma, L. Choobineh, 2013 .

Supervised Machine-Learning Approach for the Optimal Arrangement of Active Hotspots in 3-D Integrated Circuits

Srikanth Rangarajan, Bahgat Sammakia, Leila Choobineh, 2021, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Determination of temperature distribution in three-dimensional integrated circuits (3D ICs) with unequally-sized die

Ankur Jain, Leila Choobineh, A. Jain, 2013 .

An explicit analytical model for rapid computation of temperature field in a three-dimensional integrated circuit (3D IC)

Ankur Jain, Leila Choobineh, A. Jain, 2015 .

Analytical Solution for Steady-State and Transient Temperature Fields in Vertically Stacked 3-D Integrated Circuits

A. Jain, L. Choobineh, 2012 .

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Srikanth Rangarajan, Bahgat Sammakia, Bahgat Sammakia, 2020 .

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Ankur Jain, Leila Choobineh, A. Jain, 2017 .

Thermal investigation of silicon and glass interposer-based microelectronic systems

L. Choobineh, David Fresne, Tyler Eisgruber, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Microelectronics Thermal Sensing: Future Trends

Ankur Jain, Leila Choobineh, M JhaChandra, 2015 .

Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices

Adam J. Morgan, D. Hopkins, L. Choobineh, 2017 .