M. Rabold

Surface-Energy Characterization of Full-Wafer Bonds Using the Concealed Blister Test Method

P. Woias, F. Goldschmidtboeing, M. Rabold, 2009 .

Non-Destructive Strength Characterization of Full-Wafer Bonds Using a Modified Blister Test Method

P. Woias, A. Doll, F. Goldschmidtboing, 2006, 19th IEEE International Conference on Micro Electro Mechanical Systems.

Zerstörungsfreie Haftfestigkeitscharakterisierung von Full-Wafer-Bondverbindungen (Non-destructive strength characterization of full-wafer-bonds)

P. Woias, F. Goldschmidtböing, A. Doll, 2006 .

The modified blister test method

P. Woias, F. Goldschmidtboeing, A. Doll, 2007 .

Low Temperature Wafer Bonding: Plasma Assisted Silicon Direct Bonding vs. Silicon-Gold Eutectic Bonding

P. Woias, F. Goldschmidtboeing, H. Kuster, 2008 .

Versatile low temperature wafer bonding and bond strength measurement by a blister test method

P. Woias, F. Goldschmidtböing, A. Doll, 2006 .

Strategies for void-free liquid filling of micro cavities

F. Goldschmidtboeing, P. Woias, P. Woias, 2005, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05..