Masanori Muroyama

发表

Development of a Real-Time Force and Temperature Sensing System with MEMS-LSI Integrated Tactile Sensors for Next-Generation Robots

Masanori Muroyama, Hideki Hirano, Chenzhong Shao, 2020, J. Robotics Mechatronics.

Development of ballistic hot electron emitter and its applications to parallel processing: active-matrix massive direct-write lithography in vacuum and thin-film deposition in solutions

Masayoshi Esashi, Masanori Muroyama, Jun-ichi Shirakashi, 2015 .

Testing, Repairing and Packaging Technology for the CMOS-MEMS Integrated Tactile Sensor

Yutaka Nonomura, Masanori Muroyama, Shuji Tanaka, 2013 .

Integrated 3-axis tactile sensor using quad-seesaw-electrode structure on platform LSI with through silicon vias

Yutaka Nonomura, Masanori Muroyama, Shuji Tanaka, 2018 .

超並列電子線描画装置用アクティブマトリックスナノ結晶シリコン電子源の開発と動作特性評価に関するレビュー;超並列電子線描画装置用アクティブマトリックスナノ結晶シリコン電子源の開発と動作特性評価に関するレビュー;Review of Development and Performance Evaluation of Active-matrix Nanocrystalline Si Electron Emitter Array for Massively Parallel Electron Beam Direct-write Lithography

Masayoshi Esashi, Masanori Muroyama, Shinya Yoshida, 2015 .

Fully-integrated, fully-differential 3-axis tactile sensor on platform LSI with TSV-based surface-mountable structure

Yutaka Nonomura, Shuji Tanaka, Masanori Muroyama, 2017, 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).

An On-Chip Bus Architecture for Post-Fabrication Performance Compensation

Hiroto Yasuura, Masanori Muroyama, 安浦寛人, 2007 .

Development of a MEMS electrostatic condenser lens array for nc-Si surface electron emitters of the Massive Parallel Electron Beam Direct-Write system

Masanori Muroyama, Masayoshi Esashi, Shinya Yoshida, 2016, SPIE Advanced Lithography.

A Study of Dependence on Gate Depth/Width for Analyzing Delay/Power Variations in 90nm CMOS Circuits

Hiroto Yasuura, Yuan Yang, Masanori Muroyama, 2007 .

Measurement of Delay and Power Variation in 90nm CMOS Circuits

Hiroto Yasuura, Masanori Muroyama, Yuan Yang, 2006 .

Tactile Sensing System Module with Multiple Cmos-Mems Integrated Sensors on 16 Mbps High Speed Shared Serial Bus Line

Shuji Tanaka, Masanori Muroyama, Chenzhong Shao, 2019, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII).

Simulation analysis of a miniaturized electron optics of the massively parallel electron-beam direct-write (MPEBDW) for multi-column system

Masayoshi Esashi, Masanori Muroyama, Shinya Yoshida, 2017, Advanced Lithography.

17×17並列電子源駆動システムの開発;17×17並列電子源駆動システムの開発;Development of a 17×17 Parallel Electron Beam Lithography System

Masayoshi Esashi, Shuji Tanaka, Masanori Muroyama, 2016 .

Multi-sensor platform LSI enabling different sensors to be event-driven and connected to common differental bus line

Shuji Tanaka, Masanori Muroyama, Takahiro Nakayama, 2017, 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).

CMOS-on-LTCC integrated fingertip sensor with 3-axis tactile and thermal sensation for robots

Shuji Tanaka, Masanori Muroyama, Takahiro Nakayama, 2017, 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).

Development of an LSI for Tactile Sensor Systems on the Whole-Body of Robots

Yutaka Nonomura, Masayoshi Esashi, Shuji Tanaka, 2011 .

Advanced LSI-based amperometric sensor array with light-shielding structure for effective removal of photocurrent and mode selectable function for individual operation of 400 electrodes.

Masayoshi Esashi, Masanori Muroyama, Atsushi Suda, 2015, Lab on a chip.

3-Axis fully-integrated surface-mountable differential capacitive tactile sensor by CMOS flip-bonding

Yutaka Nonomura, Shuji Tanaka, Masanori Muroyama, 2016, 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS).

An LSI for Massive Parallel Electron Beam Lithography: Its Design and Evaluation

Masayoshi Esashi, Shuji Tanaka, Masanori Muroyama, 2015 .

A multiple sensor platform with dedicated CMOS-LSIs for robot applications

Yutaka Nonomura, Shuji Tanaka, Masanori Muroyama, 2016, 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS).

Surface-mountable capacitive tactile sensors with flipped CMOS-diaphragm on a flexible and stretchable bus line☆

Yutaka Nonomura, Shuji Tanaka, Masanori Muroyama, 2016 .

Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection

Yutaka Nonomura, Masayoshi Esashi, Shuji Tanaka, 2012 .

300 μm Deep through silicon via in laser-ablated CMOS multi-project wafer for cost-effective development of integrated MEMS

Yutaka Nonomura, Shuji Tanaka, Masanori Muroyama, 2017, 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS).

Quad-seesaw-electrode type 3-axis tactile sensor with low nonlinearities and low cross-axis sensitivities

Yutaka Nonomura, Shuji Tanaka, Masanori Muroyama, 2017 .

A Simulated Network System Prototype for Development of a Networked Tactile Sensor System with Integrated MEMS-LSI Tactile Sensors

Yutaka Nonomura, Masayoshi Esashi, Shuji Tanaka, 2012 .

Adhesive wafer bonding using a molded thick benzocyclobutene layer for wafer-level integration of MEMS and LSI

Yutaka Nonomura, Masayoshi Esashi, Shuji Tanaka, 2011 .