J. Stopford

Three Dimensionial Surface Modelling: A Novel Analysis Technique for Non-Destructive X-Ray Diffraction Imaging of Semiconductor Die Warpage & Strain in Fully Encapsulated Integrated Circuits

A. Danilewsky, P. McNally, D. Manessis, 2012, 1204.1466.

Discrete Mode Laser Diodes with Ultra Narrow Linewidth Emission ≪ 3kHz

L. Barry, B. Kelly, J. O'Carroll, 2008, OFC/NFOEC 2008 - 2008 Conference on Optical Fiber Communication/National Fiber Optic Engineers Conference.

Three Dimensionial Surface Modelling: A Novel Analysis Technique for Non-Destructive X-Ray Diffraction Imaging of Semiconductor Die Warpage & Strain in Fully Encapsulated Integrated Circuits

A. Danilewsky, P. McNally, D. Manessis, 2012, 1204.1466.

Ultraviolet and visible Raman analysis of thin a-C films grown by filtered cathodic arc deposition

T. Perova, D. McCulloch, J. Wasyluk, 2010 .

Three-dimensional X-ray diffraction imaging of process-induced dislocation loops in silicon

A. Danilewsky, P. McNally, J. Wittge, 2011 .

Combined use of three-dimensional X-ray diffraction imaging and micro-Raman spectroscopy for the non-destructive evaluation of plasma arc induced damage on silicon wafers

A. Danilewsky, P. McNally, M. Morshed, 2011 .