Guokui Ju

Effect of 3.0wt. %Bi and 0.05wt. %Cr additions on the microstructure and tensile strength of the Sn3Ag0.5Cu/Cu solder joint

Xicheng Wei, Yongjiu Han, Fei Lin, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Exotic spin-orbital Mott insulating states in BaIrO3

Zhongqin Yang, Guokui Ju, Zq Yang, 2013 .

Study of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during thermal ageing

Wang Junjie, Yongjiu Han, Fei Lin, 2014 .

Interfacial IMC layer growth and tensile properties of low‐silver Cu/SACBE/Cu solder joints

Fei Lin, Guokui Ju, S. Xie, 2012 .

Evolution of Ag3Sn at Sn–3.0Ag–0.3Cu–0.05Cr/Cu joint interfaces during thermal aging

Wurong Wang, Fei Lin, Guokui Ju, 2011 .