Y. Chen

Influence of Lanthanum Additions on the Microstructure and Microhardness of Sn-3.5Ag Solder

Hwa-Teng Lee, Y. Chen, 2009 .

Effect of La addition on adhesive strength and fracture behavior of Sn-3.5Ag solder joints

A. Schwedt, J. Mayer, Hwa-Teng Lee, 2011 .

Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn–3.5Ag solder

Hwa-Teng Lee, Y. Chen, 2011 .

Processing mechanism of electrical discharge-assisted milling titanium alloy based on 3D thermal-mechanical coupling cutting model

T. Ko, Lei Huang, Shu-jian Li, 2022, Journal of Manufacturing Processes.

Study on the Formation of the Crater and Modified Layer in EDM Titanium Alloys Based on Fluid–Solid Coupled Temperature Field Model

T. Ko, Chang-ping Li, Lei Huang, 2023, International Journal of Precision Engineering and Manufacturing.