Wenxing Dong

Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints

Y. Lei, Yaowu Shi, Z. Xia, 2009 .

Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy

Y. Lei, Yaowu Shi, Z. Xia, 2008 .

Mechanical characteristics and in vitro degradation kinetics analysis of polylactic glycolic acid/β-tricalcium phosphate (PLGA/β-TCP) biocomposite interference screw

Shuyu Zhao, Xiaoxiao Huang, Li-hua Chen, 2020 .

Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy

Y. Lei, Yaowu Shi, Z. Xia, 2009 .

Effects of Ti and Nb Stabilization on the Recrystallization and the Pitting Potential in Fe-21%Cr Ferritic Stainless Steels

Lai-zhu Jiang, Li Ma, Wenxing Dong, 2007 .

Toughened Laminated Alumina/Silica Ceramics Formed by Weakening Interlayer Bonded Strength

Jinpeng Fan, Wenxing Dong, Juan Zhang, 2018, Solid State Phenomena.