J. Han

Electromigration in Pb‐Free Solder Joints in Electronic Packaging

K. Tu, Chih Chen, H. Hsiao, 2012 .

Electromigration failure with thermal gradient effect in SnAgCu solder joints with various UBM

K. Tu, Luhua Xu, S. Liang, 2009, 2009 59th Electronic Components and Technology Conference.

Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column

Y. Lai, K. Tu, Luhua Xu, 2008 .

Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration

Y. Lai, K. Tu, Luhua Xu, 2010 .

Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography

Feng Xu, Lukas Helfen, Tilo Baumbach, 2011 .

Current density redistribution from no current crowding to current crowding in Pb-free solder joints with an extremely thick Cu layer

K. Tu, Nobuhiko Chiwata, M. Fujiyoshi, 2012 .

Warpage Modulation Study on Panel-level Compression Molding Technology for Heterogenous Integration Applications

R. Manepalli, J. Han, Zhixin Xie, 2023, Electronic Components and Technology Conference.