K. Takemura

A Silicon Interposer With an Integrated ${\rm SrTiO}_{3}$ Thin Film Decoupling Capacitor and Through-Silicon Vias

A. Shibuya, A. Ouchi, K. Takemura, 2010, IEEE Transactions on Components and Packaging Technologies.

Si interposers integrated with SrTiO3 thin film decoupling capacitors and through-Si-vias

A. Shibuya, K. Takemura, A. Ohuchi, 2008, 2008 IEEE 9th VLSI Packaging Workshop of Japan.