C. Prior

Dielectric properties of epoxy/silica composites used for microlectronic packaging, and their dependence on post-curing

P. Gonon, Jerome Teysseyre, Alain Sylvestre, 2001 .

Combined effects of humidity and thermal stress on the dielectric properties of epoxy-silica composites

P. Gonon, Jerome Teysseyre, Alain Sylvestre, 2001 .