R. Kahle
发表
T. Braun,
K.-F. Becker,
Rolf Aschenbrenner,
2014
.
R. Aschenbrenner,
T. Braun,
R. Jordan,
2013,
2013 10th China International Forum on Solid State Lighting (ChinaSSL).
R. Aschenbrenner,
T. Braun,
J. Bauer,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
H. Reichl,
T. Braun,
K.-F. Becker,
2009,
2009 59th Electronic Components and Technology Conference.
S. Karaszkiewicz,
R. Kahle,
Lars Böttcher,
2019
.
R. Aschenbrenner,
T. Braun,
K.-F. Becker,
2012,
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
R. Aschenbrenner,
T. Braun,
J. Bauer,
2014,
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
T. Braun,
K.-D. Lang,
K.-F. Becker,
2019,
2019 International Wafer Level Packaging Conference (IWLPC).
T. Braun,
S. Voges,
R. Aschenbrenner,
2015,
2015 European Conference on Circuit Theory and Design (ECCTD).
J. Bauer,
R. Aschenbrenner,
K.-D. Lang,
2016
.
K.-F. Becker,
S. Voges,
Christian Zech,
2015
.
J. Bauer,
R. Aschenbrenner,
T. Braun,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
J. Bauer,
R. Aschenbrenner,
T. Braun,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
J. Bauer,
R. Aschenbrenner,
T. Braun,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
R. Aschenbrenner,
T. Braun,
K.-F. Becker,
2018,
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
J. Bauer,
R. Aschenbrenner,
T. Braun,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).