A. Watanabe
发表
Rao Tummala,
Siddharth Ravichandran,
Mohanalingam Kathaperumal,
2019,
International Symposium on Microelectronics.
R. Tummala,
M. Swaminathan,
Hirokazu Ito,
2021,
Applied Physics Letters.
M. Swaminathan,
Mutee ur Rehman,
Siddharth Ravichandran,
2021,
2021 IEEE MTT-S International Microwave Symposium (IMS).
R. Tummala,
M. Tentzeris,
M. Pulugurtha,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Pulugurtha Markondeya Raj,
Rao Tummala,
Atom O. Watanabe,
2020,
Journal of Electronic Materials.
Muhammad Ali,
P. Markondeya Raj,
Sk Yeahia Been Sayeed,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Tummala,
M. Tentzeris,
M. Swaminathan,
2019,
2019 IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond (IMC-5G).
Madhavan Swaminathan,
Pulugurtha M. Raj,
Muhammad Ali,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
R. Tummala,
M. Tentzeris,
V. Smet,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
R. Tummala,
P. Raj,
R. Mullapudi,
2018,
Journal of Electronic Materials.
M. Swaminathan,
Mutee ur Rehman,
Siddharth Ravichandran,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Tummala,
M. Tentzeris,
M. Swaminathan,
2020,
IEEE Transactions on Microwave Theory and Techniques.
Madhavan Swaminathan,
Rui Zhang,
Rao R. Tummala,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Madhavan Swaminathan,
Rao R. Tummala,
Hirokazu Ito,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Tummala,
M. Tentzeris,
M. Swaminathan,
2020,
IEEE Antennas and Wireless Propagation Letters.
Manos M. Tentzeris,
Fuhan Liu,
Rao R. Tummala,
2018,
IEEE Microwave and Wireless Components Letters.
M. Swaminathan,
Yuya Suzuki,
M. Kathaperumal,
2020,
Electronic Components and Technology Conference.
Manos M. Tentzeris,
Fuhan Liu,
Venkatesh Sundaram,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
R. Tummala,
M. Tentzeris,
V. Sundaram,
2018,
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Manos M. Tentzeris,
Bijan Tehrani,
Venky Sundaram,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Chandrasekharan Nair,
Rao R. Tummala,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
J. Golz,
E. Rosenbaum,
F. Libsch,
2023,
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).
X. Gu,
F. Libsch,
H. Mori,
2023,
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
R. Tummala,
M. Swaminathan,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Pulugurtha Markondeya Raj,
Manos M. Tentzeris,
Rao R. Tummala,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
M. Swaminathan,
Hirokazu Ito,
Koichi Hasegawa,
2021,
Electronic Components and Technology Conference.
R. Tummala,
Junyong Park,
Kyungjun Cho,
2021,
IEEE Transactions on Electromagnetic Compatibility.
Rao Tummala,
Manos M. Tentzeris,
Venky Sundaram,
2017,
2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO).
Rao R. Tummala,
Hirokazu Ito,
R. Tummala,
2019,
2019 International Wafer Level Packaging Conference (IWLPC).
R. Tummala,
M. Tentzeris,
M. Pulugurtha,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).