Jürgen Burggraf

Wafer bonding for MEMS and CMOS integration

Viorel Dragoi, Gerald Mittendorfer, Eric Pabo, 2011, Microtechnologies.

Thin WLFO and based WLSiP enabling WL3D, realized using Temporary Reconstituted Panel Bonding Technology

Paul Lindner, Jürgen Burggraf, Steffen Kroehnert, 2016 .

Collective Die Bonding: An Enabling Toolkit for Heterogeneous Integration

Jürgen Burggraf, Mariana Pires, Thomas Uhrmann, 2020 .

Metal Thermocompression Wafer Bonding for 3D Integration and MEMS Applications

Viorel Dragoi, Gerald Mittendorfer, Jürgen Burggraf, 2010 .

CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration

Viorel Dragoi, Gerald Mittendorfer, Eric Pabo, 2012 .