S. Haque

Metallization for direct solder interconnection of power devices

G. Lu, S. Haque, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Characterization of solderable metallization on power devices for 3-D packaging

G. Lu, S. Haque, 2000, IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426).

Three-dimensional flip-chip on flex packaging for power electronics applications

Guo-Quan Lu, Xingsheng Liu, S. Haque, 2001 .

Packaging of integrated power electronics modules using flip-chip technology

Guo-Quan Lu, Xingsheng Liu, S. Haque, 2000, APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058).

Packaging challenges of high-power LEDs for solid state lighting

Frank Wall, Shatil Haque, Paul S. Martin, 2003 .

Thermal management of power electronics modules packaged by a stacked-plate technique

Guo-Quan Lu, S. Haque, William A. Stinnett, 1999 .

An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

D. Borojevic, Ray-Lee Lin, Douglas J. Nelson, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).