Yang Xiaolong

Demonstration of TCNCP flip chip reliability with 30μm pitch Cu bump and substrate with thin Ni and thick Au surface finish

Zhang Weihong, Hong Shengping, Yang Xiaolong, 2014, ECTC 2014.

33‐1: Invited Paper: Development of AMOLED Display: From Rigid to Flexible

Xiuqi Huang, Yang Xiaolong, Xiaoyu Gao, 2016 .

Digital nuclear magnetic resonance spectrometer

Jiang Yu, Li Gengying, Yan Xiaolong, 2001 .