Baoyan Yang

Improving the colloidal stability and emulsifying property of flaxseed 11S globulin by heat induced complexation with soy 7S globulin

Ning Zhang, Ying Li, Nannan Chen, 2022, LWT.

Enabling Continuous Cu Seed Layer for Deep Through-Silicon-Vias With High Aspect Ratio by Sequential Sputtering and Electroless Plating

Zhiming Chen, Huikai Xie, Lei Xiao, 2021, IEEE Electron Device Letters.

Modeling and Characterization of Annealing-Induced Cu Protrusion of TSVs With Polyimide Liner Considering Diffusion Creep Behavior

Zhiming Chen, Anrun Ren, Lei Xiao, 2023, IEEE Transactions on Electron Devices.

Study on atomic migration of copper through-silicon-vias with Bosch scallops

Zhiming Chen, Lei Xiao, Yingtao Ding, 2021, Microelectronics Reliability.