T. Mandrekar

Nickel vs. cobalt silicide integration for sub-50nm CMOS

R. Pantel, F. Boeuf, F. Wacquant, 2003, ESSDERC '03. 33rd Conference on European Solid-State Device Research, 2003..

Ni based silicides for 45 nm CMOS and beyond

J. Kittl, A. Lauwers, M. Potter, 2004 .

Impact of Cu contacts on front-end performance: a projection towards 22nm node

M. Van Hove, T. Chiarella, G. Van den bosch, 2006, 2006 International Interconnect Technology Conference.

Manufacturable Processes for $\leq$ 32-nm-node CMOS Enhancement by Synchronous Optimization of Strain-Engineered Channel and External Parasitic Resistances

Wen-Chin Lee, S. Demuynck, Jianxin Lei, 2008, IEEE Transactions on Electron Devices.

High-field giant magnetoresistance in Co-Cu superlattices

R. Clarke, D. Barlett, L. Lauhon, 1993 .