J. Duis

All optical pluggable board-backplane interconnection system based on an MPXTM-FlexTail connector solution

J. Schrage, M. Halter, J. Duis, 2010, 2010 IEEE Photonics Society Winter Topicals Meeting Series (WTM).

A compact 10×10 Gbps transmitter module based on a low cost 3D stacking solution

O. Raz, D. Molin, P. Sillard, 2013, 2013 Optical Interconnects Conference.

A novel 3D stacking method for opto-electronic dies on CMOS ICs

O. Raz, B. Smalbrugge, H. Dorren, 2012, 2012 38th European Conference and Exhibition on Optical Communications.

Chip-to-chip interconnects based on 3D stacking of optoelectrical dies on Si

H. J. S. Dorren, O. Raz, J. Duis, 2012, Other Conferences.

PhoxTroT - a European initiative toward low cost and low power photonic interconnects for data centres

Kai Wang, Nikos Pleros, Tolga Tekin, 2015, 2015 17th International Conference on Transparent Optical Networks (ICTON).

Scalable electro-photonic integration concept based on polymer waveguides

B. J. Offrein, B. Corbett, E. Bosman, 2016, SPIE OPTO.

Optical Transceiver Module for 1.2 Tb/s Based on Flexible Circuit Technology

Bert Jan Offrein, Jonas Weiss, Daniel Jubin, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.