Jin-Sang Hwang

Feasibility study of non-conductive film (NCF) for plasma display panel (PDP) application

Jin-Sang Hwang, Ju-Yeol Kim, Seok-Chan Kang, 2009, Microelectron. Reliab..

Effects of soft segment mixtures with different molecular weight on the properties and reliability of UV curable adhesives for electrodes protection of plasma display panel (PDP)

Jin-Sang Hwang, Dong-Sung Seo, Myeong-Hwan Kim, 2009, Microelectron. Reliab..

Design of Bowing-Activity Monitoring and Automatic Detection System Using 3-Axis Accelerometer

Jin-Sang Hwang, Jeong-Whan Lee, Young-Jae Lee, 2010 .

Construction of 3D Geometric Surface Model from Laminated CT Images for the Pubis

Jin-Sang Hwang, Duhwan Mun, Ho-Jin Hwang, 2010 .

골격 모델을 기반으로 한 협업용 설계 정보의 표현 = Representation of the collaborative design information based on skeleton model

Jin-Sang Hwang, 황진상, 2009 .

Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications

Jin-Sang Hwang, Woon-Seong Kwon, Kyung-Wook Paik, 2005 .

Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film

Jin-Sang Hwang, Woon-Seong Kwon, Kyung-Wook Paik, 2004 .

High reliable non-conductive adhesives for flip chip CSP applications

Kyung-Woon Jang, Jin-Sang Hwang, Woon-Seong Kwon, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Highly reliable non-conductive adhesives for flip chip CSP applications

Jin-Sang Hwang, Woon-Seong Kwon, Kyung-Wook Paik, 2003 .

Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications

Jin-Sang Hwang, Kyung-Wook Paik, Myung Jin Yim, 2007 .