Y.M. Tan

Process Development for Realization of Embedded Structures in Multi-Layer Ceramics Platform using Carbon Fugitive Material

Y. C. Lam, L. E. Khoong, Y.M. Tan, 2008, 2008 10th Electronics Packaging Technology Conference.

Nano-Fe1-Xs Embedded Bcaa/Fe3o4 As the Stabilized Catalyst For Simultaneous Quinclorac Oxidation and Cr(Vi) Reduction

Y. Wang, Zhi Zhou, Nan Zhou, 2022, SSRN Electronic Journal.

Double Synergetic Feco-Nanoparticles and Single Atoms Embedded in N-Doped Carbon Nanotube Arrays as Efficient Bifunctional Catalyst for High-Performance Zinc-Air Batteries

Yu-Zhong Zhang, Chuanwei Cheng, Aoshuang Li, 2022, SSRN Electronic Journal.

Fabrication of thermoelectric cooler for device integration

C.K. Wong, W. Fan, K. M. Chua, 2005, 2005 7th Electronic Packaging Technology Conference.

Impact of packaging design on reliability of large die Cu/low-κ (BD) interconnect

Xiaowu Zhang, R. Murthy, W.H. Zhu, 2008, 2008 58th Electronic Components and Technology Conference.