J. Zuercher

Centrifugal Formulation of Percolating Thermal Underfills for Flip-Chip Applications

T. Brunschwiler, B. Michel, J. Goicochea, 2012, 2012 7th International Conference on Integrated Power Electronics Systems (CIPS).

Morphology of Low-Temperature All-Copper Interconnects Formed by Dip Transfer

Luca Del Carro, T. Brunschwiler, T. Wildsmith, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).