D.Q. Yu

Angled high strain rate shear testing for SnAgCu solder balls

J. Lau, T. Chai, W.H. Zhu, 2008, 2008 58th Electronic Components and Technology Conference.

Effects of Bi & Ni additives on the microstructures and wetting properties of Sn-Zn-Cu lead-free alloy

H.P. Xie, L. Wang, D.Q. Yu, 2005, Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC..

Microstructure and Mechanical Properties of AlN/Al Joints Brazing by a Sputtering Al/Cu Bilayer Film Solder

Rongbin Li, Bingyang Ma, Hailong Shang, 2022, Materials.

Microstructure and interface reaction between Sn-3.5Ag solder and electroplated Ni layer on Cu substrate during high temperature exposure

L. Wang, D.Q. Yu, J. Zhao, 2004, Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809).

The growth behavior of intermetallic compound layer of Sn-Ag-Cu/Cu interface during soldering

J.H. Wang, L. Wang, D.Q. Yu, 2005, Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC..

The evaluation of the new composite lead free solders with the novel fabricating process

H.P. Xie, L. Wang, D.Q. Yu, 2004, Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809).

Interfacial microstructure and strength of lead-free Sn-Zn-RE BGA solder bumps

D. Chi, C. Law, C.M.L. Wu, 2005, IEEE Transactions on Advanced Packaging.