J. Madhukumar

发表

C. Ko, R. Beica, J. Lau, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

J. Lau, C. Ko, R. Beica, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Xiaowu Zhang, V. Kripesh, J. Lau, 2008, 2008 10th Electronics Packaging Technology Conference.