S. Ishizawa

Advanced flip chip bonding techniques using transferred microsolder bumps

Hideki Tsunetsugu, Hideyuki Takahara, Nobutatsu Koshoubu, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Surface structural changes during the initial growth of Ge on Si(111)7 × 7

Yoshihiro Kobayashi, K. Sugii, H. Hibino, 1992 .