Ben-Je Lwo

TSV reliability model under various stress tests

Ben-Je Lwo, Frank, M-S Lin, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Characteristic Evaluation on MOSFET Stress Sensor Through the Temperature-Controlled Calibration System

Ben-Je Lwo, Yung-Ching Chao, Ming-I Yang, 2009 .

On the Study of Piezoresistive Stress Sensors for Microelectronic Packaging

Ben-Je Lwo, Ching-Hsing Kao, Tung-Sheng Chen, 2002 .

A Study on Electrical Reliability Criterion on Through Silicon Via Packaging.

Ben-Je Lwo, Kun-Fu Tseng, Kuo-Hao Tseng, 2016, Journal of electronic packaging.

The high frequency parasitic effect characterization of packages with test chip inside

Ben-Je Lwo, Kun-Fu Tseng, Tyler Lee, 2008, 2008 International Conference on Electronic Materials and Packaging.

AMultifunctional Test ChipforMicroelectronic Packaging andIts Application onRFProperty Measurements

Yi-Hsun Hsion, Ben-Je Lwo, Kun-Fu Tseng, 2005 .

Reliability of a typical TSV structure with thermal bias

Ben-Je Lwo, Kun-Fu Tseng, Kuo-Hao Tseng, 2013, 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).

Over-Temperature Forecasts on Electronic Packages Through a Transient R–C Model

Ben-Je Lwo, Kun-Fu Tseng, Luke Su Lu, 2000 .

A complete resistance extraction methodology and circuit models for typical TSV structures

Ben-Je Lwo, Chih-Yuan Lee, Hsien Chung, 2013 .

Reliability analyses on a TSV structure for CMOS image sensor

Ben-Je Lwo, Chung-Yen Ni, B. Lwo, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Calculation of the optimal clip dimensioning to minimize the influence of fabrication imperfections on the acceleration sensitivity of SC-cut quartz resonators with stiffened rectangular support systems

Ben-Je Lwo, H. F. Tiersten, 1994, Proceedings of IEEE 48th Annual Symposium on Frequency Control.

The advanced pattern designs with electrical test methodologies on through silicon via for CMOS image sensor

Ben-Je Lwo, Kun-Fu Tseng, Hsien Chung, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Calibrate piezoresistive stress sensors through the assembled structure

Ben-Je Lwo, Tung-Sheng Chen, B. Lwo, 2001, First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).