Jun Han

Metallurgical behaviors of lead-free solder alloys with respect to Ag content in a ball grid array package around melting temperatures

Jin-wook Jang, Jin-Man Park, S. Jeong, 2017, Journal of Materials Science: Materials in Electronics.

New Failure Mode of Flip-Chip Solder Joints Related to the Metallization of an Organic Substrate

S. Kim, Jin-wook Jang, Sejin Yoo, 2015, Journal of Electronic Materials.

Reducing the Coefficient of Thermal Expansion of Polyimide Films in Microelectronics Processing Using ZnS Particles at Low Concentrations

Kangtaek Lee, Cheolsang Yoon, Jun Han, 2018 .

Novel temperature stable Li2TiO3-based microwave dielectric ceramics with low loss

Di Zhou, Ruilin Liang, Yi-ding Zhang, 2015 .

Microwave Dielectric Properties of LiKSm2(MoO4)4 Ceramics with Ultralow Sintering Temperatures

Wen-Bo Li, Xu Zheng, Di Zhou, 2015 .