K. L. Tai

Multilevel Ge-Se Film Based Resist Systems

K. L. Tai, R. G. Vadimsky, E. Ong, 1982, 1982 Symposium on VLSI Technology. Digest of Technical Papers.

Low cost, high volume applications to drive high performance Si-on-Si MCM

K. L. Tai, 1993, Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium.

A new bare die test methodology

Kwang-Ting Cheng, K. L. Tai, Zao Yang, 1999, Proceedings 17th IEEE VLSI Test Symposium (Cat. No.PR00146).

Challenges and opportunities in packaging technology as ICs move toward deep sub-micron

K. L. Tai, 1997, Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307).

SI-ON-SI MCM TECHNOLOGY AND ITS APPLICATIONS

K. L. Tai, 1991 .

High Q-factor inductors integrated on MCM Si substrates

K. L. Tai, Jenshan Lin, Yicheng Lu, 1996 .

Integrated optoelectronics-to-VLSI packaging technology

K. L. Tai, J. M. Segelken, C. G. Lin-Hendel, 1989, Proceedings 1989 IEEE International Conference on Computer Design: VLSI in Computers and Processors.

Assembly and reliability of micro-scale solder interconnections for flip-chip MCMs

K. L. Tai, T. Dudderar, A. R. Storm, 1992, Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92.