M. Sawada

Novel Shallow Trench Isolation Process from Viewpoint of Total Strain Process Design for 45 nm Node Devices and Beyond

Y. Ohji, M. Inuishi, T. Kuroi, 2005 .

Effects of Fluorine Stability and Stress in SiOF Films on Film Adhesion

K. Asai, T. Fujii, M. Yoneda, 2005 .

Suppression of hydrogen-ion drift into underlying layers using plasma deposited silicon oxynitride film during high-density plasma chemical vapor deposition

K. Asai, T. Yamaguchi, H. Miyatake, 2007 .