C. Durand

Failure mechanisms in chip-metallization in power applications

H. Naceur, M. Klingler, D. Coutellier, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Metallurgical analysis and RF losses in superconducting niobium thin film cavities

P. Bosland, D. Bloess, H. Nakai, 1997, IEEE Transactions on Applied Superconductivity.

Niobium sputter-coated QWRs

S. Stark, V. Palmieri, F. Stivanello, 1997 .

Non quadratic RF losses in niobium sputter coated accelerating structures

P. Bosland, W. Weingarten, P. Bosland, 1995, IEEE Transactions on Applied Superconductivity.

Power Cycling Reliability of Power Module: A Survey

C. Durand, M. Klingler, D. Coutellier, 2016, IEEE Transactions on Device and Materials Reliability.

Solder fatigue failures in a new designed power module under Power Cycling

M. Klingler, M. Bigerelle, C. Durand, 2016, Microelectron. Reliab..

NIOBIUM SPUTTER-COATED COPPER RESONATORS

C. Benvenuti, P. Darriulat, S. Calatroni, 1997 .

Studies of RF-Superconductivity Properties of Niobium Film-Coated Cavities at CERN

C. Benvenuti, P. Darriulat, S. Calatroni, 1998 .

Study of fatigue failure in Al-chip-metallization during power cycling

Hakim Naceur, Daniel Coutellier, Markus Klingler, 2015 .