H. Li

Synthesis and performance enhancement of novel polybenzoxazines with low surface free energy

F. Chang, Shu-Chen Huang, K. Sun, 2011 .

Synthesis and characterization of a novel siloxane-imide-containing polybenzoxazine

F. Chang, K. Sun, Kai-Chi Chen, 2011 .

A novel high refractive transparent material in LED package applications

H. Li, Chia-wen Hsu, Kai-Chi Chen, 2008, 2008 International Conference on Electronic Materials and Packaging.

Enhancement of light efficiency of LED using a novel high refractive encapsulant

H. Li, Chia-wen Hsu, Kai-Chi Chen, 2008, 2008 58th Electronic Components and Technology Conference.

Positron annihilation lifetime spectroscopy study on the structural relaxation of phenylmethylsiloxane-modified epoxy hybrids at different aging temperatures

Chung-Sung Tan, C. Ma, H. Li, 2015 .

Synthesis of a liquid zirconium hybrid resin and the ability of the resin to accelerate the curing of a transparent silicone‐modified cycloaliphatic epoxy nanocomposite

Shu-Chen Huang, Chung-Sung Tan, C. Ma, 2015 .

Increasing the bonding strength of chips on flex substrates using thermosonic flip-chip bonding process with nonconductive paste

C. Chuang, H. Li, Qing-An Liao, 2010 .

Development of novel packaging structures encapsulation process, materials and reliability for matrix array over-molded flip chip CSP

T. Fukui, Shu-Chen Huang, H. Li, 2004, IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585).

Novel packaging structures, encapsulation process and materials for matrix array over-molded flip chip CSP

T. Fukui, Shu-Chen Huang, H. Li, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

Effect of thermal aging on the optical, dynamic mechanical, and morphological properties of phenylmethylsiloxane-modified epoxy for use as an LED encapsulant

Shu-Chen Huang, C. Ma, Tzong-Ming Lee, 2012 .

The study of thermal cycling performance of enacpasulant material in SMD LEDs application

Shu-Chen Huang, H. Li, Kai-Chi Chen, 2015, 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).