K. Yatsuda

Mitigation of plasma-induced damage in porous low-k dielectrics by cryogenic precursor condensation

Liping Zhang, S. Gendt, S. De Gendt, 2016 .

Cryogenic etching processes applied to porous low-k materials using SF6/C4F8 plasmas

P. Lefaucheux, R. Dussart, T. Tillocher, 2015 .

STT MRAM patterning challenges

Vasile Paraschiv, W. Boullart, Eiichi Nishimura, 2013, Advanced Lithography.

Sub-10-nm patterning process using directed self-assembly with high χ block copolymers

Katsuyoshi Kodera, Tomoharu Fujiwara, Tsukasa Azuma, 2015 .

The role of physisorption in the cryogenic etching process of silicon

C. Cardinaud, A. Girard, P. Lefaucheux, 2019, Japanese Journal of Applied Physics.

Driving DSA into volume manufacturing

Seiji Nagahara, Kathleen Nafus, Shinichiro Kawakami, 2015, Advanced Lithography.

Cryo atomic layer etching of SiO2 by C4F8 physisorption followed by Ar plasma

P. Lefaucheux, R. Dussart, T. Tillocher, 2019, Applied Physics Letters.

Cryoetching processes applied to ULK material

P. Lefaucheux, R. Dussart, T. Tillocher, 2015 .