L. Zhang

Alternative integration of ultralow-k dielectrics by template replacement approach

N. Heylen, Z. Tokei, S. De Gendt, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

Optimized pore stuffing for enhanced compatibility with interconnect integration flow

K. Croes, O. Pedreira, Z. Tokei, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

Cryogenic etching processes applied to porous low-k materials using SF6/C4F8 plasmas

P. Lefaucheux, R. Dussart, T. Tillocher, 2015 .

A detailed ellipsometric porosimetry and positron annihilation spectroscopy study of porous organosilicate-glass films with various ratios of methyl terminal and ethylene bridging groups

M. Liedke, A. G. Attallah, M. Baklanov, 2020 .