H. Wojcik

Enhanced growth and Cu diffusion barrier properties of thermal ALD TaNC films in Cu/low-k interconnects

H. Engelmann, R. Hübner, J. Bartha, 2013 .

Physical Characterization of PECVD and PEALD Ru(-C) Films and Comparison with PVD Ruthenium Film Properties

Paul S. Ho, D. Utess, Siegfried Menzel, 2011 .

Electrical Evaluation of Ru-W(-N), Ru-Ta(-N) and Ru-Mn films as Cu diffusion barriers

C. Wenzel, S. Strehle, R. Kaltofen, 2012 .

Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements

C. Wenzel, A. Jahn, F. Munnik, 2011 .

Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films

B. Hintze, S. Menzel, L. Wilde, 2009 .

Atomic layer deposition for high aspect ratio through silicon vias

T. Henke, J. Bartha, M. Albert, 2013 .

Characterization of barrier and seed layer integrity for copper interconnects

J. Bartha, D. Lehninger, H. Wojcik, 2011, 2011 Semiconductor Conference Dresden.

A comparative study of thermal and plasma enhanced ALD Ta-N-C films on SiO2, SiCOH and Cu substrates

J. Bartha, M. Albert, H. Wojcik, 2007, 2007 IEEE International Interconnect Technology Conferencee.