Sang-Soo Hwang

Electrical reliability and interfacial adhesion of Cu(Mg) thin films for interconnect process adaptability

Young-Bae Park, Young-Chang Joo, Yong-Hak Huh, 2008 .

Effect of pore interconnection on Cu-diffusion-induced failures in porous spin-on low-k dielectrics

D. Y. Yoon, Young‐Chang Joo, H. Ro, 2005 .

Characteristics of leakage current in the dielectric layer due to Cu migration during bias temperature stress

Young‐Chang Joo, Sang-Soo Hwang, Sung-Yup Jung, 2008 .

The self-formatting barrier characteristics of Cu-Mg/SiO2 and Cu-Ru/SiO2 films for Cu interconnects

Young-Chang Joo, Kwang-Ho Jang, Sang-Soo Hwang, 2008, Microelectron. Reliab..

The electric field dependence of Cu migration induced dielectric failure in interlayer dielectric for integrated circuits

Young-Chang Joo, Sang-Soo Hwang, Young‐Chang Joo, 2007 .