T.C. Chai

Parametric design and solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)

D. Pinjala, M.K. Iyer, Xiaowu Zhang, 2005, 2005 7th Electronic Packaging Technology Conference.

Development of 3-D Silicon Module With TSV for System in Packaging

Xiaowu Zhang, V. Kripesh, N. Khan, 2010, IEEE Transactions on Components and Packaging Technologies.

Impact of packaging design on reliability of large die Cu/low-κ (BD) interconnect

Xiaowu Zhang, R. Murthy, W.H. Zhu, 2008, 2008 58th Electronic Components and Technology Conference.