C. Buch
发表
Design and Demonstration of Highly Miniaturized, Low Cost Panel Level Glass Package for MEMS Sensors
V. Sundaram,
R. Tummala,
P. Hesketh,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
R. Tummala,
K. Moon,
Maysam Ghovanloo,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Chandrasekharan Nair,
P. Markondeya Raj,
2018,
IEEE Nanotechnology Magazine.
T. Chakraborty,
S. Verhaverbeke,
Han-Wen Chen,
2020,
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).