Deniz Sabuncuoglu Tezcan

发表

Process integration study of packaging materials for implant applications

Liesbet Lagae, Karl Malachowski, John O'Callaghan, 2013 .

A novel concept for ultra-low capacitance via-last TSV

Eric Beyne, Philippe Soussan, Yann Civale, 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

On the processing aspects of high performance hybrid backside illuminated CMOS imagers

Mehmet Akif Erismis, Joeri De Vos, Deniz Sabuncuoglu Tezcan, 2010 .

CMOS n-well microbolometer FPA with temperature coefficient enhancement circuitry

Tayfun Akin, Selim Eminoglu, Deniz Sabuncuoglu Tezcan, 2001, SPIE Defense + Commercial Sensing.

Uncooled microbolometer infrared focal plane array in standard CMOS

Tayfun Akin, Selim Eminoglu, Deniz Sabuncuoglu Tezcan, 2001, SPIE OPTO.

Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping

Eric Beyne, Rahul Agarwal, Philippe Soussan, 2009, 2009 IEEE International Conference on 3D System Integration.

3D Interconnect technology for space applications

Chris Van Hoof, Robert Mertens, Eric Beyne, 2005 .

A dedicated loading instrument for characterization and testing of MEMS

Chris Van Hoof, Martine Wevers, Ingrid De Wolf, 2005 .

Advanced Technologies for In-Line and Post-Processed TSV Integration

Eric Beyne, Deniz Sabuncuoglu Tezcan, Jan Van Olmen, 2009 .

Hybrid Backside Illuminated CMOS Imager for High-End Applications

Philippe Soussan, Mehmet Akif Erismis, Joeri De Vos, 2011 .

On the Fabrication of Backside Illuminated Image Sensors: Bonding Oxide, Edge Trimming and CMP Rework Routes

Farid Sebaai, Lan Peng, Deniz Sabuncuoglu Tezcan, 2015 .

Low-cost small-pixel uncooled infrared detector for large focal plane arrays using a standard CMOS process

Tayfun Akin, Selim Eminoglu, M. Yusuf Tanrikulu, 2002, SPIE Defense + Commercial Sensing.

The RELAXd project: Development of four-side tilable photon-counting imagers

Wouter Ruythooren, Zdenek Vykydal, Deniz Sabuncuoglu Tezcan, 2008 .

Reduction of Electrical Crosstalk in Hybrid Backside Illuminated CMOS Imagers using Deep Trench Isolation

Jean-Loup Bezy, Roland Meynart, Iacopo Ficai Veltroni, 2008, 2008 International Interconnect Technology Conference.

Monolithic and fully-hybrid backside illuminated CMOS imagers for smart sensing

Chris Van Hoof, Deniz Sabuncuoglu Tezcan, Koen De Munck, 2009 .

Micro vapor bubble jet flow for safe and high-rate fluorescence-activated cell sorting.

Dries Vercruysse, Kamil Blaszkiewicz, Liesbet Lagae, 2017, Lab on a chip.

Wafer level temporary bonding/debonding for thin wafer handling applications

Chris Van Hoof, Bart Swinnen, Deniz Sabuncuoglu Tezcan, 2006 .

Low-cost uncooled infrared detectors in CMOS process

Tayfun Akin, Selim Eminoglu, M. Yusuf Tanrikulu, 2003 .

Backside illuminated hybrid FPA achieving low cross-talk combined with high QE

Joeri De Vos, Deniz Sabuncuoglu Tezcan, Koen De Munck, 2011 .

Backside thinned CMOS imagers with high broadband quantum efficiency realised using new integration process

Sherif Sedky, Jan Bogaerts, Deniz Sabuncuoglu Tezcan, 2008 .

3D integration technology using W2W direct bonding and TSV for CMOS based image sensors

Nina Tutunjyan, Lan Peng, Deniz Sabuncuoglu Tezcan, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

Processing aspects to achieve high-end hybrid backside illuminated imagers

Philippe Soussan, Mehmet Akif Erismis, Joeri De Vos, 2010 .

Through-Silicon Via Technology for 3D Applications

Wouter Ruythooren, Yann Civale, Deniz Sabuncuoglu Tezcan, 2010 .

A low-cost uncooled infrared microbolometer detector in standard CMOS technology

Tayfun Akin, Selim Eminoglu, Deniz Sabuncuoglu Tezcan, 2003 .