Jaedong Kim

Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps

Young‐Chang Joo, Young-Bae Park, Byoung-Joon Kim, 2009 .

Frequency and Temperature Dependence of the Dielectric Properties of a PCB Substrate for Advanced Packaging Applications

Gang Zhang, W. Yoo, C. Ra, 2009 .

Reliability of Cu pillar bump for flip chip and 3-D SiP

Young‐Chang Joo, Young-Bae Park, Byoung-Joon Kim, 2008, 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing

Young‐Chang Joo, Ho-Young Lee, Young-Bae Park, 2010 .

Microstructure evolution in Cu pillar/eutectic SnPb solder system during isothermal annealing

Young‐Chang Joo, Ho-Young Lee, Young-Bae Park, 2009 .

Intermetallic compound and Kirkendall void growth in Cu pillar bump during annealing and current stressing

Young‐Chang Joo, Young-Bae Park, Byoung-Joon Kim, 2008, 2008 58th Electronic Components and Technology Conference.

Effect of isothermal aging on intermetallic compounds and Kirkendall void growth kinetics of Au stud bumps

Young‐Chang Joo, Young-Bae Park, Byoung-Joon Kim, 2009 .

Study of interconnection process for fine pitch flip chip

Curtis Zwenger, Minjae Lee, Jaedong Kim, 2009, 2009 59th Electronic Components and Technology Conference.