C. Jezewski

发表

Interface and layer periodicity effects on the thermal conductivity of copper-based nanomultilayers with tungsten, tantalum, and tantalum nitride diffusion barriers

F. La Mattina, S. King, P. Hopkins, 2020, Journal of Applied Physics.

Plasma‐Assisted Atomic Layer Deposition of Palladium

W. Lanford, Gwo-Ching Wang, T. Lu, 2005 .

Demonstration of new planar capacitor (PCAP) vehicles to evaluate dielectrics and metal barrier thin films

Narendra V. Lakamraju, J. Bielefeld, R. Kasim, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

Demonstration of a sidewall capacitor to evaluate dielectrics and metal barrier thin films

Narendra V. Lakamraju, Kevin L. Lin, K. Singh, 2014, IEEE International Interconnect Technology Conference.

Adhesion of Sputter-Deposited Ta to Porous-Methyl Silsesquioxane Pore Sealed with Molecular Caulk

T. Cale, J. Senkevich, Dae-Lok Bae, 2005 .

Molecular Caulking: A Pore Sealing CVD Polymer for Ultralow k Dielectrics

W. Lanford, Gwo-Ching Wang, T. Lu, 2004 .

Cu film thermal stability on plasma cleaned polycrystalline Ru

R. Nemanich, Xin Liu, S. King, 2012 .

Low temperature chemical vapor deposition of Co thin films from Co2(CO)8

Gwo-Ching Wang, T. Lu, J. Senkevich, 2005 .

Use of Polycapillary Optics to Increase the Effective Area of Microcalorimeter Spectrometers

John M. Martinis, Kent D. Irwin, Gene C. Hilton, 1997, Microscopy and Microanalysis.

Nanoscale Buckling of Ultrathin Low-k Dielectric Lines during Hard-Mask Patterning.

Igor Levin, Gheorghe Stan, Alan Myers, 2015, Nano letters.

Atomic layer deposition of Pd on TaN for Cu electroless plating

T. Karabacak, T. Lu, J. Senkevich, 2005 .

Non-Volatile RRAM Embedded into 22FFL FinFET Technology

P. Bai, C. English, A. Chen, 2019, 2019 Symposium on VLSI Technology.

Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces

W. Lanford, T. Lu, J. Senkevich, 2005 .

Substrate‐Independent Palladium Atomic Layer Deposition

W. Lanford, Gwo-Ching Wang, T. Lu, 2003 .

Opportunities in 3-D stacked CMOS transistors

G. Dewey, J. Kavalieros, M. Metz, 2021, 2021 IEEE International Electron Devices Meeting (IEDM).

Substrate-independent sulfur-activated dielectric and barrier-layer surfaces to promote the chemisorption of highly polarizable metallorganics

T. Cale, W. Lanford, Gwo-Ching Wang, 2004 .

Nanoscale Buckling of Ultrathin Low-k Dielectric Lines during Hard-Mask Patterning.

G. Stan, C. Ciobanu, S. King, 2015, Nano letters.