John Richards

Interface and layer periodicity effects on the thermal conductivity of copper-based nanomultilayers with tungsten, tantalum, and tantalum nitride diffusion barriers

F. La Mattina, S. King, P. Hopkins, 2020, Journal of Applied Physics.

Controlled fracture of Cu/ultralow-k interconnects

Jimmy Liu, M. Kobrinsky, M. Kuhn, 2013 .