R. Sivasubramony
发表
R. Stoltenberg,
J. Chang,
P. Borgesen,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
M. Poliks,
A. Alizadeh,
J. Lombardi,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
M. Poliks,
P. Borgesen,
M. Alhendi,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
P. Borgesen,
T. Alghoul,
G. Sharma,
2022,
Journal of Materials Science: Materials in Electronics.
M. Poliks,
D. Shaddock,
P. Borgesen,
2022,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
M. Poliks,
D. Shaddock,
P. Borgesen,
2022,
Additive Manufacturing.
M. Poliks,
P. Borgesen,
M. Alhendi,
2019,
Journal of Materials Research.
P. Borgesen,
L. Wentlent,
T. Alghoul,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
P. Borgesen,
L. Wentlent,
T. Alghoul,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Chun-An Chou,
Miaolin Fan,
Mohammad Samie Tootooni,
2016,
BIH.
M. Poliks,
D. Shaddock,
L. Yin,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
R. Das,
P. Thompson,
P. Borgesen,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
M. Poliks,
P. Borgesen,
E. Enakerakpo,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Chun-An Chou,
Miaolin Fan,
Mohammad Samie Tootooni,
2016,
BIH.
P. Borgesen,
L. Wentlent,
T. Alghoul,
2019,
Microelectronics Reliability.
P. Borgesen,
M. Kokash,
R. Sivasubramony,
2021,
Journal of Electronic Packaging.
M. Poliks,
J. Iannotti,
P. Borgesen,
2020,
Advanced Engineering Materials.
M. Poliks,
J. Iannotti,
P. Borgesen,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
M. Ronay,
M. Poliks,
B. Garakani,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).