Dong-Jun Lee

发表

Inhomogeneous Hardness Distribution of High Pressure Torsion Processed IF Steel Disks

Chong Soo Lee, E. Yoon, Yue-peng Song, 2012 .

Corrosion behavior of electroless nickel/immersion gold plating by interfacial morphology

Hyo-Jong Lee, S. Huh, Dong-Jun Lee, 2015, Electronic Materials Letters.

Structural and Electrochemical Properties of Al-Added Molybdate Conversion Coatings on Zinc

H. Sohn, T. Kang, Hyung-Joon Kim, 2002 .

Ultrafine Grained Cu-diamond Composites using High Pressure Torsion

Hyoung-Seop Kim, Taek-Soo Kim, E. Yoon, 2012 .

Densification and Nanocrystallization of Water-Atomized Pure Iron Powder Using High Pressure Torsion

Hyoung-Seop Kim, Heeseung Kang, Haneul Kim, 2011 .

Effect of the Thermal Annealing on the Stretchability and Fatigue Failure of the Copper Film on the Polymer Substrate

Young‐Chang Joo, Young-Bae Park, Byoung-Joon Kim, 2019, Journal of Electronic Materials.

Densification of Copper Powders using High-pressure Torsion Process

Hyoung-Seop Kim, S. Kang, E. Yoon, 2012 .

Major factors to the solder joint strength of ENIG layer in FC BGA package

Dong-Jun Lee, Hyo S. Lee, Hyo-Soo Lee, 2006, Microelectron. Reliab..

Highly conductive and smooth surfaced flexible transparent conductive electrode based on silver nanowires

Haekyoung Kim, Byoung-Joon Kim, M. Shinde, 2019, Thin Solid Films.

Two-step flash light sintering process for crack-free inkjet-printed Ag films

Sung-Hyeon Park, Je Hoon Oh, S. Jang, 2012 .

Application of k-Means Clustering to Material Research: Measurement of Layer Thickness and Contact Angle

Jun Hyun Kim, Yongsug Chung, In-Jun Hwang, 2023, Metals and Materials International.

Adsorption behavior of anionic polyelectrolyte for chemical mechanical polishing (CMP).

Sarah Kim, Seung‐Man Yang, J. So, 2008, Journal of colloid and interface science.