Michael Gaynes

Organic Multi-Chip Module for high performance systems

Christian Baks, Lei Shan, Young Kwark, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Microfluidic two-phase cooling of a high power microprocessor part B: Test and characterization

Pritish R. Parida, Ute Drechsler, Mark D. Schultz, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Preparing 25Gbps electrical I/O for exascale computing systems

Christian Baks, Lei Shan, Manabu Hoshino, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Microfluidic two-phase cooling of a high power microprocessor part A: Design and fabrication

Pritish R. Parida, Ute Drechsler, Mark D. Schultz, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Thermal model for embedded two-phase liquid cooled microprocessor

Thomas Brunschwiler, Pritish R. Parida, Alper Buyuktosunoglu, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

High performance wafer level underfill material with high filler loading

Michael Gaynes, Claudius Feger, Jae-Woong Nah, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

The over-bump applied resin wafer-level underfill process: Process, material and reliability

Michael Gaynes, Claudius Feger, Mark Francis, 2009, 2009 59th Electronic Components and Technology Conference.