A. Bouchou

A mechanical model for the computation of phenolic foams in compression

C. Gontier, A. Bouchou, C. Vinot, 2001 .

3-D finite elements simulation of drop test reliability on a Chip Scale Package: Focus on the component architecture and materials

A. Bouchou, S. Belhenini, F. Dosseul, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.