Woo-Jae Kim

Etching characteristics of NF3 and F3NO at reactive ion etching plasma for silicon oxide and silicon nitride

Yongjun Cho, Ji Hwan Kim, G. Kwon, 2021, Journal of the Korean Physical Society.

Investigating the Wafer Temperature in an Atmospheric-Pressure Plasma Process

G. Kwon, H. Lee, Woo-Jae Kim, 2020, Journal of the Korean Physical Society.

Correlation between Density of Reentry Plasma and Frequency of Attenuated Electromagnetic Signals Based on Laboratory Measurements

Woo-Jae Kim, In-Young Bang, Hee-Tae Kwon, 2023, Aerospace.

Measurement of re-entry plasma density using microwave reflectometer in laboratory.

G. Kwon, Woo-Jae Kim, In-Young Bang, 2022, The Review of scientific instruments.

Plasma Etching of Silicon at a High Flow and a High Pressure of NF3 in Reactive Ion Etching

Min-Ho Kang, G. Kwon, H. Lee, 2019, Journal of the Korean Physical Society.

Silicon Oxide Etching Process of NF3 and F3NO Plasmas with a Residual Gas Analyzer

Min-Ho Kang, G. Kwon, Ji-Hwan Kim, 2021, Materials.