J. M. Duffalo

A scalable thermal mechanical test chip for package characterization and qualifications

J. M. Duffalo, S. M. Domer, R. L. Hollstein, 1994, Proceedings of 1994 IEEE International Integrated Reliability Workshop (IRWS).

Evaluation of a plastic encapsulated package using a scalable thermal mechanical test chip

J. M. Duffalo, A. K. Hullinger, A. J. Niederkorn, 1995, Proceedings of 1995 IEEE International Reliability Physics Symposium.

Novel failure modes with overmolded printed circuit board-based surface mount packages

J. M. Duffalo, D. L. Erhart, S. C. Schmok, 1993, 31st Annual Proceedings Reliability Physics 1993.

Particulate contamination and device performance

J. M. Duffalo, J. Monkowski, J. R. Monkowski, 1984 .