A. K. Hullinger

A scalable thermal mechanical test chip for package characterization and qualifications

J. M. Duffalo, S. M. Domer, R. L. Hollstein, 1994, Proceedings of 1994 IEEE International Integrated Reliability Workshop (IRWS).

Evaluation of a plastic encapsulated package using a scalable thermal mechanical test chip

J. M. Duffalo, A. K. Hullinger, A. J. Niederkorn, 1995, Proceedings of 1995 IEEE International Reliability Physics Symposium.