Yimin Huang

Defect reduction of copper BEOL for advanced ULSI interconnect

Chaoqun Huang, T. Yew, T. Tsai, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Low Temperature Electroless Ni–P Catalyst Deposition Enhanced by UV Exposure for Carbon Nanofiber and Nanotube Growth

H. Su, T. Yew, Chung-Min Tsai, 2010 .