Eva E. Simonyi

Chemical and mechanical properties of UV-cured nanoimprint resists and release layer interactions

Frances A. Houle, Simone Raoux, Christopher V. Jahnes, 2008, SPIE Advanced Lithography.

Low-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes

Fen Chen, Daniel C. Edelstein, Ian D. Melville, 2005, SPIE Optics East.