Fei Liu

Subtractive W contact and local interconnect co-integration (CLIC)

Michael A. Guillorn, Eric A. Joseph, Sebastian U. Engelmann, 2013, 2013 IEEE International Interconnect Technology Conference - IITC.

Ultra Low Contact Resistivities for CMOS Beyond 10-nm Node

C. Cabral, C. Lavoie, J. Newbury, 2013, IEEE Electron Device Letters.

Design and Modeling Methodology of Vertical Interconnects for 3DI Applications

Xiaoxiong Gu, Fei Liu, R Gordin, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Dopant-Segregation Technique for Leakage Reduction and Performance Improvement in Trigate Transistors Without Raised Source/Drain Epitaxy

Josephine B. Chang, M. Khater, M. Guillorn, 2014, IEEE Electron Device Letters.